This application report describes design issues relevant to the parallel backplanes typically used in the wireless, datacom, telecom, and networking markets. Designing a high-performance backplane is extremely complex, because issues such as distributed capacitance, stub lengths, noise margin, rise time (slew rate), flight time, and propagation delay must be defined and optimized to achieve good signal integrity along the transmission line.


From TI
출처:http://www.pcb.pe.kr/